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전자부품 데이터시트 검색엔진 |
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LM317AEMPX/NOPB 데이터시트(PDF) 6 Page - Texas Instruments |
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LM317AEMPX/NOPB 데이터시트(HTML) 6 Page - Texas Instruments |
6 / 38 page ![]() LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com LM317A and LM317-N Electrical Characteristics (1) (continued) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA. LM317A LM317-N Parameter Conditions Min Typ Max Min Typ Max Units NDS (TO-3) Package - 2 NDE (TO-220) Package 4 4 KTT (TO-263) Package - 4 Thermal Resistance, θJC °C/W Junction-to-Case DCY (SOT-223) Package 23.5 23.5 NDT (TO) Package 21 21 MDT (PFM) Package 12 12 NDS (TO-3) Package - 39 NDE (TO-220) Package 50 50 Thermal Resistance, θJA KTT (TO-263) Package (3) - 50 Junction-to-Ambient (No °C/W DCY (SOT-223) Package (3) 140 140 Heat Sink) NDT (TO) Package 186 186 MDT (PFM) Package (3) 103 103 (3) When surface mount packages are used (TO-263, SOT-223, PFM), the junction to ambient thermal resistance can be reduced by increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink techniques. 6 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N |
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