(0,80 mm) .0315"

QSE SERIES

QSE–060–01–F–D–A

QSE–028–01–F–D–DP–A

QSE–020–01–L–D–A

Blade &

Beam

Design

Integral metal plane

for power or ground

WWW.SAMTEC.COM

APPLICATION

SPECIFIC OPTION

• 14 mm, 15 mm, 22 mm

and 30 mm stack height

(Caution: Some automatic

placement/inspection

machines may have

component height

restrictions. Please

consult machinery

specifications.)

• 30µ" (0,76 µm) Gold

(Specify -H plating for

Data Rate cable mating

applications.)

• Edge Mount

• 56 (-DP), 80, 100

positions per row

• Guide Posts and Friction

Lock options.

• Retention Option

Call Samtec.

F-213

*Note: –C Plating passes

10 year MFG testing

Note: Some lengths, styles

and options are non-standard,

non-returnable.

SPECIFICATIONS

Board Mates:

QTE

Cable Mates:

EQCD, EQSD, EQDP, EQRF

(See Application Specific note)

QSE

PINS PER ROW

NO. OF PAIRS

PLATING

OPTION

–020, –040, –060

(40 total pins per bank = –D)

–014, –028, –042

(14 pairs per bank = –D–DP)

–D

= Single-

Ended

–D–DP

= Differential

Pair

(–01 only)

TYPE

A

OTHER

OPTION

01

(0,64)

.025

(20,00) .7875

–D = (No. of Positions per Row/20) x

(20,00) .7875 + (1,27) .050

–D–DP = (No. of Positions per Row/14) x

(20,00) .7875 + (1,27) .050

01

02

(7,49)

.295

(0,15)

.006

(0,80)

.0315

(3,25)

.128

(3,05)

.120

(0,76)

.030

(7,24)

.285

(0,89)

.035

DIA

–L

–K

= (8,25 mm) .325"

DIA Polyimide

Film Pick &

Place Pad

–TR

= Tape & Reel

Packaging

(N/A on 56 &

80 positions)

–L

= Latching Option

(N/A on 42, 56, 60

& 80 positions)

–F

= Gold Flash on

Signal Pins and

Ground Plane, Matte

Tin on tails

–L

= 10µ" (0,25 µm) Gold

on Signal Pins

and Ground Plane,

Matte Tin on tails

–C*

= Electro-Polished

Selective

50µ" (1,27 µm) min

Au over 150µ"

(3,81 µm) Ni on Signal

Pins in contact area,

10µ" (0,25 µm) min

Au over 50µ" (1,27 µm)

Ni on Ground Plane

in contact area,

Matte Tin over 50µ"

(1,27 µm) min Ni on

all solder tails

®

EXTENDED LIFE PRODUCT

10 year Mixed Flowing Gas with 50µ" Gold

TM

Call Samtec for maximum cycles mated with QTE

HIGH SPEED GROUND PLANE SOCKET

QTE

LEAD

STYLE

MATED

HEIGHT

WITH QSE*

–01

(5,00) .197

–02

(8,00) .315

–03

(11,00) .433

–04

(16,00) .630

–05

(19,00) .748

–07

(25,00) .984

*Processing

conditions will

affect mated height.

QTE/QSE

5 mm Stack Height

Type

Rated @ 3dB Insertion Loss

with PCB effects*

w/o PCB effects**

Single-Ended Signaling

–D

9 GHz / 18 Gbps

9 GHz / 18 Gbps

Differential Pair Signaling

–D

8 GHz / 16 Gbps

14 GHz / 28 Gbps

Differential Pair Signaling

–DP

8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps

*Performance data includes effects of a non-optimized PCB.

**Test board losses de-embedded from performance data.

Performance data for other stack heights and complete test data

available at www.samtec.com?QSE or contact sig@samtec.com

finalinch.com

®

For complete specifications and

recommended PCB layouts see

www.samtec.com?QSE

Insulator Material:

Liquid Crystal

Polymer

Terminal Material:

Phosphor Bronze

Plating:

Au or Sn over

50µ" (1,27 µm) Ni

Current Rating:

Contacts:

1.3A per contact @ 95°C

Ground Plane:

10.1A per ground plane @ 95°C

Operating Temp Range:

-55°C to +125°C

Voltage Rating:

225 VAC (5 mm Stack Height)

Max Cycles:

100

RoHS Compliant:

Yes

Processing:

Lead–Free Solderable:

Yes

SMT Lead Coplanarity:

(0,10 mm) .004" max (020-060)

Board Stacking:

For applications requiring more

than two connectors per board

contact ipg@samtec.com

100 GbE

XAUI

PCI Express

®

SATA

MGT (Rocket

I/O)

InfiniBand

™

Download app

notes at

www.samtec.com/appnote

Contact SIG

@ samtec.com

for questions

on protocols

Protocols

Supported

ALSO AVAILABLE

Board Spacing Standoffs.

See SO Series.