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DSPIC33FJMC202ESS 데이터시트(PDF) 305 Page - Microchip Technology |
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DSPIC33FJMC202ESS 데이터시트(HTML) 305 Page - Microchip Technology |
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305 / 330 page ![]() © 2007-2012 Microchip Technology Inc. DS70283K-page 305 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 44 Pitch e 0.65 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E 8.00 BSC Exposed Pad Width E2 6.30 6.45 6.80 Overall Length D 8.00 BSC Exposed Pad Length D2 6.30 6.45 6.80 Contact Width b 0.25 0.30 0.38 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 – – D EXPOSED PAD D2 e b K L E2 2 1 N NOTE 1 2 1 E N BOTTOM VIEW TOP VIEW A3 A1 A Microchip Technology Drawing C04-103B |
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