전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

GRJ552B11H102KA01D 데이터시트(PDF) 213 Page - Murata Manufacturing Co., Ltd.

부품명 GRJ552B11H102KA01D
상세설명  Chip Monolithic Ceramic Capacitors
PDF  221 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  MURATA [Murata Manufacturing Co., Ltd.]
홈페이지  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

GRJ552B11H102KA01D 데이터시트(HTML) 213 Page - Murata Manufacturing Co., Ltd.

Back Button GRJ552B11H102KA01D Datasheet HTML 209Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 210Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 211Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 212Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 213Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 214Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 215Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 216Page - Murata Manufacturing Co., Ltd. GRJ552B11H102KA01D Datasheet HTML 217Page - Murata Manufacturing Co., Ltd. Next Button
Zoom Inzoom in Zoom Outzoom out
 213 / 221 page
background image
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively large, the risk of cracking is higher during
board bending or under any other stressful conditions.
Continued from the preceding page.
Optimum Solder Amount for Flow Soldering
5. Flow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. Additionally, an excessively long
soldering time or high soldering temperature results in
leaching by the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in Table 2. It is required
to keep temperature differential between the soldering
and the components surface (
∆T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
G
--18/21/31
∆TV150D
Part Number
Temperature Differential
Table 2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
,,,
,,,
,,,







Soldering Time (sec.)
260
270
250
240
230
010
20
30
Up to Chip Thickness
Adhesive
Recommended Conditions
Peak Temperature
Atmosphere
Pb-Sn Solder
240-250
°C
Air
Lead Free Solder
250-260
°C
N2
60-120 seconds
5 seconds max.
∆T
Gradual
Cooling
Soldering
Preheating
170
°C
150
°C
130
°C
Time
Temperature (
D)
Peak Temperature
,,,
,,,
,,,









Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Continued on the following page.
in section
!Caution
212
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
C02E.pdf
10.12.20



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com