7

TGA8035-SCC

MECHANICAL DRAWING

1,4681

(0.0578)

0,2108

(0.0083)

2,3114

(0.0910)

0,1803

(0.0071)

1,4656

(0.0577)

0,2108

(0.0083)

0,4039

(0.0159)

0,9246

(0.0364)

1,8034

(0.0710)

2,1590

(0.0850)

2,4892

(0.0980)

0

0

65

4

3

2

1

2,0574

(0.081)

Units: millimeters (inches)

Thickness: 0,1143 (0.045) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad.

Chip size tolerance: ± 0,0508 (0.002)

Bond pad #1 (RF Input):

0,0940 x 0,2362 (0.0037 x 0.0093)

Bond pad #2 (RF Output):

0,0991 x 0,2413 (0.0039 x 0.0095)

Bond pad #3 (V

0,2286 x 0,1143 (0.0090 x 0.0045)

Bond pad #4 (V

0,2286 x 0,1143 (0.0090 x 0.0045)

Bond pad #5 (V

0,2286 x 0,1143 (0.0090 x 0.0045)

Bond pad #6 (V

0,2286 x 0,1143 (0.0090 x 0.0045)

TriQuint Semiconductor, Inc.

•

Texas Facilities

• (972) 995-8465

• www.triquint.com