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PIC16LF72/ML 데이터시트(PDF) 121 Page - Microchip Technology |
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PIC16LF72/ML 데이터시트(HTML) 121 Page - Microchip Technology |
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121 / 136 page ![]() 2002 Microchip Technology Inc. DS39597B-page 119 PIC16F72 28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) Foot Angle Top φ 04 804 8 15 12 0 15 12 0 β Mold Draft Angle Bottom 15 12 0 15 12 0 α Mold Draft Angle Top 0.51 0.42 0.36 .020 .017 .014 B Lead Width 0.33 0.28 0.23 .013 .011 .009 c Lead Thickness 1.27 0.84 0.41 .050 .033 .016 L Foot Length 0.74 0.50 0.25 .029 .020 .010 h Chamfer Distance 18.08 17.87 17.65 .712 .704 .695 D Overall Length 7.59 7.49 7.32 .299 .295 .288 E1 Molded Package Width 10.67 10.34 10.01 .420 .407 .394 E Overall Width 0.30 0.20 0.10 .012 .008 .004 A1 Standoff § 2.39 2.31 2.24 .094 .091 .088 A2 Molded Package Thickness 2.64 2.50 2.36 .104 .099 .093 A Overall Height 1.27 .050 p Pitch 28 28 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units 2 1 D p n B E E1 L c β 45 ° h φ A2 α A A1 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-052 § Significant Characteristic |
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