RPC564L60L5BFSR datasheet(134/137 Pages) STMICROELECTRONICS

134 / 137 page

Package characteristics

RPC56EL60L5

134/137

DocID026934 Rev 1

TITLE: LFBGA 14x14x1.7 257 F17x17 PITCH 0.8 BALL 0.4

PACKAGE CODE:

JEDEC/EIAJ REFERENCE NUMBER: JEDEC STANDARD NO.95 SECTION 4.5

(Fine pitch, Square Ball Grid Array Package Design Guide)

DIMENSIONS

DATABOOK

(mm)

DRAWING

(mm)

REF.

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

NOTES

1.70

1.45

(1)

0.21

0.25

0.30

0.35

1.085

1.03

1.085

1.14

0.30

0.26

0.30

0.34

0.80

0.77

0.785

0.80

0.35

0.40

0.45

0.35

0.40

0.45

(2)

13.85

14.00

14.15

13.85

14.00

14.15

12.80

13.85

14.00

14.15

13.85

14.00

14.15

12.80

0.80

0.6

ddd

0.12

eee

0.15

(3)

fff

0.08

(4)

NOTES:

(1) - LFBGA stands for

Low profile Fine Pitch Ball Grid Array.

- Low Profile: The total profile height (Dim A) is measured from the seating plane to the top of the component

- The maximum total package height is calculated by the following methodology:

A2 Typ+A1 Typ + (A1²+A3²+A4² tolerance values)

- Low profile: 1.20mm < A

1.70mm / Fine pitch: e < 1.00mm pitch.

(2) – The typical ball diameter before mounting is 0.40mm.

(3) - The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true position

with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball must lie

within this tolerance zone.

(4) - The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position

as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.

Each tolerance zone fff in the array is contained entirely in the respective zone eee above

The axis of each ball must lie simultaneously in both tolerance zones.

(5) - The terminal A1 corner must be identified on the top surface by using a corner chamfer,

ink or metallized markings, or other feature of package body or integral heatslug.

- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1

corner. Exact shape of each corner is optional.

RPC564L60L5BFSR 데이터시트(PDF) 134 Page - STMicroelectronics

RPC564L60L5BFSR 데이터시트(HTML) 134 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

데이터시트 다운로드

링크 URL