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STLUX325ATR 데이터시트(PDF) 117 Page - STMicroelectronics |
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STLUX325ATR 데이터시트(HTML) 117 Page - STMicroelectronics |
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117 / 126 page ![]() DocID027870 Rev 1 117/126 STLUX Thermal characteristics 126 13 Thermal characteristics STLUX functionality cannot be guaranteed when the device operating exceeds the maximum chip junction temperature (TJmax). TJmax, in degrees Celsius, may be calculated using Equation 7: Equation 7 TJmax = TAmax + PDmax x JA) where: TAmax is the maximum ambient temperature in °C JA is the package junction to ambient thermal resistance in °C/W PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax) PINTmax is the product of IDD and VDD, expressed in watts. This is the maximum chip internal power. PI/Omax represents the maximum power dissipation on output pins where: PI/Omax = (VOL * IOL) + [(VDD - VOH) * IOH], taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level. Table 95. Package thermal characteristics Symbol Parameter Value Unit JA TSSOP38 - Thermal resistance junction to ambient(1) 1. Thermal resistance is based on the JEDEC JESD51-2 with the 4-layer PCB in a natural convection environment. 80 °C/W JA VFQFPN32 - Thermal resistance junction to ambient(1) 26 °C/W JA TSSOP28 - Thermal resistance junction to ambient(1) 80 °C/W |
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