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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LAN8742Ai-CZ 데이터시트(PDF) 118 Page - Microchip Technology |
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LAN8742Ai-CZ 데이터시트(HTML) 118 Page - Microchip Technology |
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118 / 124 page  LAN8742A/LAN8742Ai DS00001989A-page 118 2013-2015 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 2.60 2.60 MILLIMETERS 0.50 BSC MIN E MAX 3.90 Contact Pad Length (X24) Contact Pad Width (X24) Y1 X1 0.85 0.30 Microchip Technology Drawing C04-2143A S4QFN NOM 24-Lead Very Thin Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [VQFN] SILK SCREEN 1 2 24 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 3.90 Contact Pad to Center Pad (X24) G1 0.23 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: SMSC Legacy S4QFN G2 Contact Pad to Contact Pad (X20) G2 0.20 |
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