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TNETV2664FIBZWT 데이터시트(PDF) 240 Page - Texas Instruments

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부품명 TNETV2664FIBZWT
상세설명  Fixed-Point Digital Signal Processor
PDF  249 Pages
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제조업체  TI1 [Texas Instruments]
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TNETV2664FIBZWT 데이터시트(HTML) 240 Page - Texas Instruments

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TMS320C6424
SPRS347D – MARCH 2007 – REVISED DECEMBER 2009
www.ti.com
7
Mechanical Data
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT and ZDU
mechanical package(s).
7.1
Thermal Data for ZWT
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
5.4
N/A
2
R
ΘJB
Junction-to-board
16.0
N/A
3
26.6
0.00
4
R
ΘJA
Junction-to-free air
21.9
1.0
5
20.4
2.00
7
0.0
0.00
8
PsiJT
Junction-to-package top
0.1
1.0
9
0.2
2.00
11
15.9
0.00
12
PsiJB
Junction-to-board
15.8
1.0
13
15.3
2.00
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
(2)
m/s = meters per second
240
Mechanical Data
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