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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F302x8 데이터시트(PDF) 121 Page - STMicroelectronics |
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STM32F302x8 데이터시트(HTML) 121 Page - STMicroelectronics |
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121 / 138 page  DocID025147 Rev 6 121/138 STM32F302x6 STM32F302x8 Package information 134 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 39. WLCSP49 marking example (package top view) 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. Table 78. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. |
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