STM32F769AI datasheet(243/255 Pages) STMICROELECTRONICS

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STM32F769AI 데이터시트(PDF) 243 Page - STMicroelectronics

부품명	STM32F769AI

상세설명	Dual mode Quad-SPI

PDF	255 Pages

Scroll/Zoom	100%

제조업체	STMICROELECTRONICS [STMicroelectronics]

홈페이지	http://www.st.com

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243 / 255 page

DocID029041 Rev 4

243/255

STM32F765xx STM32F767xx STM32F768Ax STM32F769xx

Package information

254

Figure 96. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

1. Dimensions are expressed in millimeters.

Table 130. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules

(0.4 mm pitch)

Dimension

Recommended values

Pitch

0.4

Dpad

0.225 mm

Dsm

0.290 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.250 mm

Stencil thickness

0.1 mm

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