전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

Preview PDF HTML

MPXM2102AS 데이터시트(PDF) 157 Page - Motorola, Inc

부품명 MPXM2102AS
상세설명  Sensor
PDF  670 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  MOTOROLA [Motorola, Inc]
홈페이지  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPXM2102AS 데이터시트(HTML) 157 Page - Motorola, Inc

Back Button MPXM2102AS Datasheet HTML 153Page - Motorola, Inc MPXM2102AS Datasheet HTML 154Page - Motorola, Inc MPXM2102AS Datasheet HTML 155Page - Motorola, Inc MPXM2102AS Datasheet HTML 156Page - Motorola, Inc MPXM2102AS Datasheet HTML 157Page - Motorola, Inc MPXM2102AS Datasheet HTML 158Page - Motorola, Inc MPXM2102AS Datasheet HTML 159Page - Motorola, Inc MPXM2102AS Datasheet HTML 160Page - Motorola, Inc MPXM2102AS Datasheet HTML 161Page - Motorola, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 157 / 670 page
background image
3–11
Motorola Sensor Device Data
www.motorola.com/semiconductors
Unibody Cross–sectional Drawings
Figure 9. Cross–Sectional Diagrams (not to scale)
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
ABSOLUTE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
ABSOLUTE ELEMENT
P1
P2
P1
Figure 9 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX series pressure sensor operating characteristics
and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long term
stability. Contact the factory for information regarding media
compatibility in your application.
Figure 10. Cross–Sectional Diagram (not to scale)
FLUORO SILICONE
DIE COAT
WIRE BONDS
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
EPOXY CASE
P1
Figure 10 illustrates the differential/gauge die in the
basic chip carrier (Case 473). A silicone gel isolates the
die surface and wirebonds from the environment, while
allowing the pressure signal to be transmitted to the
silicon diaphragm.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com