MPXM2102AS datasheet(207/670 Pages) MOTOROLA

207 / 670 page

MPX4100 SERIES

3–61

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross Sectional Diagram

(Not to Scale)

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD

FRAME

STAINLESS

STEEL CAP

EPOXY

PLASTIC

CASE

DIE

BOND

ABSOLUTE ELEMENT

SEALED VACUUM REFERENCE

DIE

Figure 3. Recommended Power Supply Decoupling.

For output filtering recommendations, please refer

to Application Note AN1646.

1.0

IPS

OUTPUT

+5 V

0.01

Figure 2 illustrates an absolute sensing chip in the basic

chip carrier (Case 867). A fluorosilicone gel isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sen-

sor diaphragm. The MPX4100A series pressure sensor

operating characteristics, and internal reliability and quali-

fication tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects

on sensor performance and long–term reliability. Contact

the factory for information regarding media compatibility in

your application.

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

°C. (The output will saturate outside of the specified pres-

sure range.)

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

2.5

2.0

1.5

1.0

0.5

Figure 4. Output versus Absolute Pressure

TEMP = 0 to 85

°C

20 kPa TO 105 kPa

MPX4100A

TRANSFER FUNCTION:

Vout = Vs* (.01059*P–.152) ± Error

VS = 5.1 Vdc

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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