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PIC12CE673 데이터시트(PDF) 103 Page - Microchip Technology |
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PIC12CE673 데이터시트(HTML) 103 Page - Microchip Technology |
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103 / 116 page ![]() © 1998 Microchip Technology Inc. Preliminary DS40181B-page 103 PIC12CE67X 14.0 PACKAGING INFORMATION 14.1 Package Marking Information Legend: MM...M Microchip part number information XX...X Customer specific information* AA Year code (last 2 digits of calendar year) BB Week code (week of January 1 is week ‘01’) C Facility code of the plant at which wafer is manufactured O = Outside Vendor C = 5” Line S = 6” Line H = 8” Line D Mask revision number E Assembly code of the plant or country of origin in which part was assembled Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. MMMMMMMM XXXXXCDE AABB 8-Lead PDIP (300 mil) Example 8-Lead Windowed Ceramic Side Brazed (300 mil) Example 12CE674 04/PSAZ 9725 CE674 JW MMMMMM MM |
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