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Amkor Technology
   http://www.amkor.com

   Part number  Description
   CSPNL  Wafer  Level  Packaging
   CBGA  From  innovative  designs  and  expanding  package  offerings,  Amkor  provides  a platform  from  prototype-to-production.
   CDIP  Ceramic  Dual-Inline  Package
   CERPAK  Ceramic  Pack
   CABGA  ChipArray짰 Packages
   CLGA  Ceramic  Land  Grid  Array  Package
   CMCM  Ceramic  Multi-Chip  Module  Package
   CPGA  Ceramic  Pin  Grid  Array  Package
   CQFP  Ceramic  Quad  Flat  Pack  Package
   CSOIC  Ceramic  Small  Outline  Integrated  Circuit  Package
   CSSOP  Ceramic  Shrink  Small  Outline  Package
   ETCSP  the  first  ball  grid  array  capable  of an extremely  thin  0.5 mm maximum  mounted  height.
   FCCSP  a flip  chip  solution  in a CSP  package  format.
   FLATPACK  Ceramic  Flat  Pack  Package
   LCC  Leadless  Chip  Carrier  Package
   LQFP  Low  Profile  Quad  Flat  Pack  (LQFP)  Packages
   LQFPPOWERQUAD2  LQFP  PowerQuad짰 2 Packages
   LQFPPOWERQUAD4  LQFP  PowerQuad짰 4 Packages
   MCMPBGA  Innovative  designs  and  expanding  package  offerings  provide  a platform  from  prototype-to-production
   MQFPPOWERQUAD2  Exceptional  thermal  and  electrical  performance  by design  include  the  following
   MQFP  Amkor?셲 MQFP  IC package  portfolio  provides
   PBGA  Innovative  designs  and  expanding  package  offerings  provide  a platform  from  prototype-to-production
   PDIP  Amkor?셲 PDIP  packages  offer
   PLCC  Amkor?셲 PLCC  IC package  portfolio  provides
   PPGA  Plastic  Pin  Grid  Array  Package
   POWERSOP2  Exceptional  performance  through  the  innovative  design  of PSOPs  offer
   PSVFBGA  Package  on Package  (PoP)  Family
   FCBGA  Package  sizes  from  10 mm to 55 mm (60  mm and  65 mm in development)
   SO8-FL  Interconnect  - Cu clips  technology  for  better  electrical  and  thermal
   SOD123-FL  Bare  copper  leadframe  with  no plating
   SOD128-FL  Bare  copper  leadframe  with  no plating
   SOD323-FL  Interconnect  - Cu clips  technology  for  better  electrical  and  thermal
   SSOP  Shrink  Small  Outline,  Quarter-Size  Small-Outline  Packages
   TSON8-FL  Bare  copper  leadframe  with  no plating
   CERAMIC  Glass  or solder  seal  up to 435C
   FUSIONQUAD  Increased  I/O  (116  to 356)  in smaller  package  footprints
   MICROLEADFRAME  Saw  MLF  PEL  (Plated  End  Lead)  Package
   POWERSOP  Power  Small  Outline  Package,PowerSOP
   WLCSP  Wafer  Level  Processing  and  Die  Processing  Services


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