The **ATS-01B-87-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" attachment series designed to cool electronic components such as processors, GPUs, and power modules. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-01B-87-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.12°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Springs | --- ### 2. Key Electronic & Mechanical Components The assembly consists of several functional parts that work together to ensure heat dissipation: #### A. The Heat Sink Body (Extrusion) * **Geometry:** It features a straight-fin design which allows air to flow through the channels, removing heat from the base. * **Material Science:** Made from Aluminum 6063, which offers an excellent balance between thermal conductivity and structural integrity. * **Anodization:** The blue anodized coating is not just for aesthetics; it increases the surface emissivity and protects the aluminum from corrosion. #### B. The Push-Pin Fasteners * **Function:** These are plastic pins that pass through pre-drilled holes in the Printed Circuit Board (PCB). * **The Locking Mechanism:** They feature a "barbed" or expandable tip that locks into the PCB, providing a secure, tool-less installation. #### C. Compression Springs * **Pressure Management:** Located around the push-pins, these springs provide a consistent downward force (preload). * **Importance:** This ensures that the heat sink maintains firm contact with the electronic chip, minimizing the "Thermal Contact Resistance." --- ### 3. Thermal Performance Profile Thermal performance depends heavily on the velocity of airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.74 | | 400 (2.0 m/s) | 4.40 | | 600 (3.0 m/s) | 3.45 | --- ### 4. Typical Applications * **BGA Cooling:** Ball Grid Array components like FPGAs. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Embedded Systems:** Industrial PCs where mechanical vibration resistance is required (provided by the spring-loaded pins).