ATS-01D-69-C2-R0
AI

The **ATS-01D-69-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **push-pin** attachment series, designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Base Dimensions** | 45mm x 45mm |
| **Height** | 20mm |
| **Attachment Type** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 11.51°C/W (Unducted Flow @ 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Components
The heat sink is engineered with several key electronic cooling features:
* **Straight Fin Design:** The fins are arranged in a straight-line pattern to allow air to pass through efficiently, reducing the pressure drop across the component.
* **Push-Pin Attachment:** It uses plastic or brass pins with springs. This ensures even pressure across the surface of the electronic chip, which is critical for maximizing heat transfer to the base.
* **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, a phase-change material that fills microscopic air gaps between the heat sink and the electronic component.
* **Aluminium 6063:** This alloy is chosen for its excellent thermal conductivity and lightweight properties.
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### 3. Application Use Cases
The ATS-01D-69-C2-R0 is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of networking switches and routers.
2. **Power Electronics:** Dissipating heat from high-speed transistors and voltage regulators.
3. **Embedded Systems:** Industrial PCs where mechanical stability (via push-pins) is required due to vibration.
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### 4. Part Number Breakdown (Nomenclature)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **01D** | Push-Pin Series / Attachment Style |
| **69** | Specific Fin Configuration / Size Code |
| **C2** | Material/Finish Code (Blue Anodized Aluminum) |
| **R0** | Revision / RoHS Compliant status |
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What are the alternatives to push-pin mounting for this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ What is the maximum TDP (Thermal Design Power) this heat sink can handle?