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  • ATS-01D-69-C2-R0

  • AI
    The **ATS-01D-69-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **push-pin** attachment series, designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 11.51°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Components The heat sink is engineered with several key electronic cooling features: * **Straight Fin Design:** The fins are arranged in a straight-line pattern to allow air to pass through efficiently, reducing the pressure drop across the component. * **Push-Pin Attachment:** It uses plastic or brass pins with springs. This ensures even pressure across the surface of the electronic chip, which is critical for maximizing heat transfer to the base. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, a phase-change material that fills microscopic air gaps between the heat sink and the electronic component. * **Aluminium 6063:** This alloy is chosen for its excellent thermal conductivity and lightweight properties. --- ### 3. Application Use Cases The ATS-01D-69-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Power Electronics:** Dissipating heat from high-speed transistors and voltage regulators. 3. **Embedded Systems:** Industrial PCs where mechanical stability (via push-pins) is required due to vibration. --- ### 4. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **01D** | Push-Pin Series / Attachment Style | | **69** | Specific Fin Configuration / Size Code | | **C2** | Material/Finish Code (Blue Anodized Aluminum) | | **R0** | Revision / RoHS Compliant status |
    ✨ Follow-up Questions
    • ⤷ What are the alternatives to push-pin mounting for this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ What is the maximum TDP (Thermal Design Power) this heat sink can handle?