The **ATS-01F-20-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-01F-20-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | ~7.14°C/W (at 100 LFM) | --- ### 2. Key Components & Design Features #### A. Fin Profile (Straight Fin) The "F" in the part number often denotes a specific fin pattern. This heatsink utilizes a **Straight Fin** design, which is optimized for **forced air convection** (where a fan is present). This allows air to flow through the channels with minimal resistance. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this part uses a specialized "pushPIN" mechanism: * **Brass Components:** The pins are often made of brass for durability. * **Compression Springs:** These ensure a consistent, pre-determined pressure is applied to the chip, optimizing thermal interface material (TIM) performance. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized coating increases surface emissivity and provides corrosion resistance. --- ### 3. Application Use Cases This specific size (45mm) and height (25mm) make it suitable for: * **CPUs/GPUs:** Cooling mid-range processors. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed logic operations. * **Telecommunications Gear:** Used in routers and switches where air is actively pushed through the chassis. --- ### 4. Thermal Performance Data *Note: Performance varies based on airflow (LFM - Linear Feet per Minute).* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.14 | | 300 (1.5 m/s) | 2.36 | | 500 (2.5 m/s) | 1.46 |