The **ATS-01F-93-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a breakdown of its technical specifications and physical properties. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance (Low Flow)** | 12.32°C/W @ 100 LFM | | **Thermal Resistance (High Flow)** | 2.50°C/W @ 700 LFM | --- ### 2. Design and Construction #### **A. Fin Configuration (Straight Fin)** The "93" in the part number indicates the specific fin design. This model utilizes a **straight-fin** pattern, which is optimized for systems with a defined airflow direction. #### **B. Attachment Mechanism (pushPIN™)** Instead of using messy thermal adhesives or tapes, this part uses a mechanical push-pin system: * **Springs:** Provides consistent pressure for optimal thermal interface material (TIM) performance. * **Pins:** Usually made of brass or plastic, designed to snap into pre-drilled holes on a PCB (Printed Circuit Board). #### **C. Material and Finish** * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized:** The coating protects against corrosion and increases surface emissivity (the ability to radiate heat). --- ### 3. Dimensional Data | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 20.00 mm | | **Pitch** | 33.00 mm (Distance between mounting holes) | --- ### 4. Implementation Details This part is commonly used in: 1. **Telecommunications:** Cooling high-speed processors. 2. **Embedded Systems:** Industrial PCs where space is constrained but heat dissipation is critical. 3. **Power Supplies:** Managing heat on MOSFETs or voltage regulators. ---