ATS-03F-40-C2-R0
AI

The **ATS-03F-40-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series and is designed for electronic components requiring efficient thermal management, such as CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table outlines the mechanical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Thermal Resistance** | 14.56°C/W (at 100 LFM) |
| **Flow Pattern** | XC-Cut (Cross-cut) |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Key Electronic Components & Features
#### A. Thermal Interface Material (TIM)
The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is typically a phase-change material or high-conductivity grease that fills microscopic air gaps between the electronic component (heat source) and the aluminum base to maximize heat transfer.
#### B. PushPIN™ Attachment System
Instead of using messy adhesives or soldering, this part uses a mechanical push-pin system.
- **Springs:** Stainless steel springs provide precise pressure to ensure the heat sink remains in contact with the electronic chip under vibration.
- **Hardware:** Usually includes brass or plastic pins that lock into pre-drilled holes on the Printed Circuit Board (PCB).
#### C. Cross-Cut (XC) Fin Design
The fins are not just straight lines; they are "cross-cut." This allows for:
1. **Multi-directional Airflow:** It can dissipate heat effectively regardless of which way the fan is blowing.
2. **Turbulence Generation:** It breaks up laminar airflow, which increases the cooling efficiency compared to smooth fins.
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### 3. Application Use Cases
This part is commonly found in the following electronic environments:
* **Embedded Systems:** Industrial PCs and controllers.
* **Networking Hardware:** High-speed routers and switches.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Computing:** Secondary cooling for chipsets on motherboards.
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- ⤷
What is the difference between the C1
- ⤷ C2
- ⤷ and C3 finish variants for this series?
- ⤷ How do I calculate if the 14.56°C/W thermal resistance is sufficient for my chip?
- ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?