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  • ATS-03F-40-C2-R0

  • AI
    The **ATS-03F-40-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series and is designed for electronic components requiring efficient thermal management, such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 14.56°C/W (at 100 LFM) | | **Flow Pattern** | XC-Cut (Cross-cut) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is typically a phase-change material or high-conductivity grease that fills microscopic air gaps between the electronic component (heat source) and the aluminum base to maximize heat transfer. #### B. PushPIN™ Attachment System Instead of using messy adhesives or soldering, this part uses a mechanical push-pin system. - **Springs:** Stainless steel springs provide precise pressure to ensure the heat sink remains in contact with the electronic chip under vibration. - **Hardware:** Usually includes brass or plastic pins that lock into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Cross-Cut (XC) Fin Design The fins are not just straight lines; they are "cross-cut." This allows for: 1. **Multi-directional Airflow:** It can dissipate heat effectively regardless of which way the fan is blowing. 2. **Turbulence Generation:** It breaks up laminar airflow, which increases the cooling efficiency compared to smooth fins. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: * **Embedded Systems:** Industrial PCs and controllers. * **Networking Hardware:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Computing:** Secondary cooling for chipsets on motherboards. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 finish variants for this series?
    • ⤷ How do I calculate if the 14.56°C/W thermal resistance is sufficient for my chip?
    • ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?