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  • ATS-04F-192-C2-R0

  • AI
    The **ATS-04F-192-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series, known for its standardized mounting system and efficient fin design. | Parameter | Specification | |:---|:---| | **Part Number** | ATS-04F-192-C2-R0 | | **Material** | Aluminum (AL-6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.35 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 30mm | | **Fin Pattern** | Cross-Cut (Square pins) | --- ### 2. Physical Design Features #### A. Cross-Cut Fin Geometry Unlike straight-fin heat sinks, the "Cross-Cut" design uses a grid of square pins. This increases surface area and allows air to flow through the heat sink from multiple directions (omnidirectional), making it less dependent on the exact orientation of the fan. #### B. Material and Coating * **Aluminum 6063:** Provides high thermal conductivity and is lightweight. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer increases the emissivity of the surface, slightly improving heat dissipation through radiation and protecting the metal from corrosion. #### C. Mounting Mechanism (pushPIN™) The "04F" designation refers to the specific hardware used. It features: * **Brass Push Pins:** For durable attachment to the PCB. * **Compression Springs:** These ensure consistent pressure (Pre-assembled) against the component to maximize heat transfer across the Thermal Interface Material (TIM). --- ### 3. Thermal Performance Analysis The efficiency of the ATS-04F-192-C2-R0 is highly dependent on the velocity of the airflow (Measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** ~2.35 °C/W * **High Airflow (700 LFM):** ~0.66 °C/W This data suggests that this heat sink is highly effective in active cooling environments (where a fan is present) rather than purely passive environments. --- ### 4. Part Number Breakdown | Segment | Meaning | |:---|:---| | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **04** | Push Pin Type/Style | | **F** | Plastic Pin Material | | **192** | Specific Size/Model Reference | | **C2** | Thermal Performance Class / Finish Code | | **R0** | RoHS Compliant / Revision |
    ✨ Follow-up Questions
    • ⤷ What are the recommended thermal interface materials (TIM) for this heat sink?
    • ⤷ How does the pushPIN mounting compare to traditional adhesive thermal tape?
    • ⤷ Can this heat sink be used in a natural convection environment without a fan?