ATS-04F-63-C2-R0
AI

The **ATS-04F-63-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table highlights the core technical attributes of this part:
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) with Spring |
| **Dimensions** | 40mm x 40mm x 20mm |
| **Fin Style** | Straight (Vertical) |
| **Thermal Resistance** | 2.85°C/W @ 200 LFM |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Functional Components
#### A. The Heat Sink Body
* **Material:** Made of high-grade aluminum for a balance of weight and thermal conductivity.
* **Fin Design:** It uses a high-aspect-ratio fin design which maximizes the surface area available for convective cooling by the surrounding air.
* **Coating:** The "Blue Anodized" finish isn't just aesthetic; it provides corrosion resistance and slightly improves emissivity.
#### B. The Mounting System (Push-Pins)
* **Mechanical Connection:** It uses two brass push-pins. These pins pass through pre-drilled holes in the PCB.
* **Compression Springs:** The pins are paired with springs that apply a specific, consistent downward pressure on the electronic chip. This ensures optimal contact and prevents air gaps.
#### C. Thermal Interface Material (TIM)
* **T766:** This part comes with a pre-applied phase-change material or thermal pad. It fills the microscopic air gaps between the chip surface and the heat sink base to facilitate efficient heat transfer.
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### 3. Performance Metrics
The effectiveness of the ATS-04F-63-C2-R0 depends on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 2.85 |
| **400 (2.0 m/s)** | 1.80 |
| **600 (3.0 m/s)** | 1.43 |
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### 4. Part Number Breakdown
The part number follows the standard ATS nomenclature:
* **ATS:** Advanced Thermal Solutions.
* **04:** Series/Family.
* **F:** Fin profile/configuration.
* **63:** Specific dimensions/height code.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
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How do I calculate if this heat sink is sufficient for my chip's TDP?
- ⤷ What are the PCB hole requirements for the brass push-pins?
- ⤷ Does the T766 thermal interface material require a burn-in period?