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  • ATS-04F-63-C2-R0

  • AI
    The **ATS-04F-63-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the core technical attributes of this part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Spring | | **Dimensions** | 40mm x 40mm x 20mm | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | 2.85°C/W @ 200 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Functional Components #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for a balance of weight and thermal conductivity. * **Fin Design:** It uses a high-aspect-ratio fin design which maximizes the surface area available for convective cooling by the surrounding air. * **Coating:** The "Blue Anodized" finish isn't just aesthetic; it provides corrosion resistance and slightly improves emissivity. #### B. The Mounting System (Push-Pins) * **Mechanical Connection:** It uses two brass push-pins. These pins pass through pre-drilled holes in the PCB. * **Compression Springs:** The pins are paired with springs that apply a specific, consistent downward pressure on the electronic chip. This ensures optimal contact and prevents air gaps. #### C. Thermal Interface Material (TIM) * **T766:** This part comes with a pre-applied phase-change material or thermal pad. It fills the microscopic air gaps between the chip surface and the heat sink base to facilitate efficient heat transfer. --- ### 3. Performance Metrics The effectiveness of the ATS-04F-63-C2-R0 depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 2.85 | | **400 (2.0 m/s)** | 1.80 | | **600 (3.0 m/s)** | 1.43 | --- ### 4. Part Number Breakdown The part number follows the standard ATS nomenclature: * **ATS:** Advanced Thermal Solutions. * **04:** Series/Family. * **F:** Fin profile/configuration. * **63:** Specific dimensions/height code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
    • ⤷ What are the PCB hole requirements for the brass push-pins?
    • ⤷ Does the T766 thermal interface material require a burn-in period?