전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

  • ATS-06F-17-C2-R0

  • AI
    The **ATS-06F-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.24mm x 54.24mm x 15.00mm | | **Thermal Resistance (Unducted)** | 4.30°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Compression Spring (ATS-PPS-06) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics The "06F" designator refers to a specific fin pattern and mounting style. Key aspects include: * **maxiFLOW™ Fin Profile:** Features a tapered fin design that maximizes surface area while minimizing pressure drop. This allows for better airflow through the fins, making it ideal for high-velocity air environments. * **pushPIN™ Attachment:** This system replaces traditional adhesive tapes or fragile clips. It uses a hardware-based approach (springs and pins) to ensure uniform pressure across the component surface, which optimizes heat transfer. * **Blue Anodization:** The surface treatment provides corrosion resistance and enhances the emissivity of the aluminum, slightly improving radiative heat transfer. --- ### 3. Electronic Application This heat sink is typically used for cooling: 1. **CPUs / GPUs:** Mid-range processors in industrial computing. 2. **ASICs/FPGAs:** High-speed signal processing chips that generate localized heat. 3. **Power Modules:** MOSFET arrays or IGBTs requiring stable thermal dissipation. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **06F** | Specific series and fin geometry | | **17** | Height code (approx. 15-17mm depending on base) | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision/Packaging code |
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 Thermal Interface Material used on this part?
    • ⤷ How does pushPIN™ mounting compare to adhesive-based heat sink attachment?
    • ⤷ What are the specific airflow requirements to achieve the 4.30°C/W thermal resistance?