ATS-06F-17-C2-R0
AI

The **ATS-06F-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors and integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 54.24mm x 54.24mm x 15.00mm |
| **Thermal Resistance (Unducted)** | 4.30°C/W @ 200 LFM |
| **Attachment Method** | pushPIN™ (Brass Pins) |
| **Spring Type** | Compression Spring (ATS-PPS-06) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design Characteristics
The "06F" designator refers to a specific fin pattern and mounting style. Key aspects include:
* **maxiFLOW™ Fin Profile:** Features a tapered fin design that maximizes surface area while minimizing pressure drop. This allows for better airflow through the fins, making it ideal for high-velocity air environments.
* **pushPIN™ Attachment:** This system replaces traditional adhesive tapes or fragile clips. It uses a hardware-based approach (springs and pins) to ensure uniform pressure across the component surface, which optimizes heat transfer.
* **Blue Anodization:** The surface treatment provides corrosion resistance and enhances the emissivity of the aluminum, slightly improving radiative heat transfer.
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### 3. Electronic Application
This heat sink is typically used for cooling:
1. **CPUs / GPUs:** Mid-range processors in industrial computing.
2. **ASICs/FPGAs:** High-speed signal processing chips that generate localized heat.
3. **Power Modules:** MOSFET arrays or IGBTs requiring stable thermal dissipation.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **06F** | Specific series and fin geometry |
| **17** | Height code (approx. 15-17mm depending on base) |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | Revision/Packaging code |
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What is the significance of the T766 Thermal Interface Material used on this part?
- ⤷ How does pushPIN™ mounting compare to adhesive-based heat sink attachment?
- ⤷ What are the specific airflow requirements to achieve the 4.30°C/W thermal resistance?