ATS-06F-18-C2-R0
AI

The **ATS-06F-18-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push-pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Type** | Fine Pitch (Straight Fins) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 15mm |
| **Thermal Resistance** | 2.29°C/W @ 200 LFM |
| **Compliance** | RoHS Compliant |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to identify the product's attributes:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **06**: Series identifier (Push-pin attachment).
* **F**: Fin pitch/density (e.g., Fine, Ultra-Fine).
* **18**: Designates specific physical dimensions/geometry.
* **C2**: Thermal Interface Material (TIM) code. "C2" typically indicates **T766** phase-change material or a specific high-performance pad.
* **R0**: Revision code or packaging indicator.
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### 3. Key Electronic Functions
While this is a mechanical component, its role in an electronic circuit is critical for **Thermal Management**:
1. **Heat Dissipation:** It increases the surface area of the semiconductor package, allowing heat to transfer more efficiently into the surrounding air via convection.
2. **Protection:** By maintaining the junction temperature ($T_j$) within safe operating limits, it prevents thermal throttling or permanent damage to the silicon.
3. **Attachment Security:** The push-pin mechanism uses a brass or plastic pin with a high-tension spring to ensure a consistent downward force (pressure) on the chip, which optimizes the performance of the Thermal Interface Material (TIM).
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### 4. Implementation Example
To use this part in a PCB design, you must account for the mounting hole pattern:
```text
PCB Layout Requirements:
- Hole Diameter: ~3.0mm (standard for ATS plastic push-pins)
- Hole Spacing: Matches the 45mm x 45mm footprint
- Keep-out Zone: Ensure no capacitors or tall components are within the 45mm square.
```
- ⤷
What is the significance of the 'Blue Anodized' finish for thermal performance?
- ⤷ How do I calculate the required airflow (LFM) for this specific heat sink?
- ⤷ Can the push-pins be replaced with metal screws for high-vibration environments?