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  • ATS-06F-18-C2-R0

  • AI
    The **ATS-06F-18-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push-pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Fine Pitch (Straight Fins) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 2.29°C/W @ 200 LFM | | **Compliance** | RoHS Compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Series identifier (Push-pin attachment). * **F**: Fin pitch/density (e.g., Fine, Ultra-Fine). * **18**: Designates specific physical dimensions/geometry. * **C2**: Thermal Interface Material (TIM) code. "C2" typically indicates **T766** phase-change material or a specific high-performance pad. * **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic Functions While this is a mechanical component, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation:** It increases the surface area of the semiconductor package, allowing heat to transfer more efficiently into the surrounding air via convection. 2. **Protection:** By maintaining the junction temperature ($T_j$) within safe operating limits, it prevents thermal throttling or permanent damage to the silicon. 3. **Attachment Security:** The push-pin mechanism uses a brass or plastic pin with a high-tension spring to ensure a consistent downward force (pressure) on the chip, which optimizes the performance of the Thermal Interface Material (TIM). --- ### 4. Implementation Example To use this part in a PCB design, you must account for the mounting hole pattern: ```text PCB Layout Requirements: - Hole Diameter: ~3.0mm (standard for ATS plastic push-pins) - Hole Spacing: Matches the 45mm x 45mm footprint - Keep-out Zone: Ensure no capacitors or tall components are within the 45mm square. ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Blue Anodized' finish for thermal performance?
    • ⤷ How do I calculate the required airflow (LFM) for this specific heat sink?
    • ⤷ Can the push-pins be replaced with metal screws for high-vibration environments?