The **ATS-06F-19-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Thermal Resistance** | 9.77°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features and Design This part is engineered for cooling semiconductors and integrated circuits (ICs) in high-density electronic environments. * **Fin Profile (Fine Pitch):** The "F" in the part number denotes a fine-pitch fin design. This maximizes surface area, allowing for better heat dissipation in forced-air environments (fan-cooled systems). * **pushPIN™ Attachment:** Instead of messy adhesives or clips, it uses a specialized push-pin mechanism. This ensures constant pressure (load) on the processor, which improves thermal transfer and makes assembly repeatable. * **Material Science:** Made from lightweight aluminum with a blue anodized coating. Anodization not only provides corrosion resistance but also slightly improves emissivity for radiant cooling. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a phase-change material or high-performance thermal pad that fills microscopic air gaps between the component and the heat sink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **06** | Series number (pushPIN™) | | **F** | Fin Pitch (Fine) | | **19** | Dimensions/Reference Code | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications * **Telecommunications:** High-speed routers and switches. * **Computing:** CPU/GPU cooling in industrial PCs or servers. * **Power Electronics:** Cooling for MOSFETs or IGBTs in power conversion modules.