The **ATS-06F-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Key Features and Design The part number can be broken down to understand its specific engineering features: * **pushPIN™ Attachment:** This system uses a spring-loaded pin mechanism. This provides a precise, consistent pressure (preload) against the component, which optimizes the thermal interface material (TIM) performance. * **Straight Fin Design:** The "F" in the part number often denotes a specific fin orientation. Straight fins are ideal for environments with consistent, directional airflow. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized coating provides increased surface area at a microscopic level and protects the aluminum from corrosion. * **C2 Thermal Interface:** The "C2" suffix typically indicates that the heat sink comes pre-applied with a high-performance Thermal Interface Material (T-605 or similar), simplifying the assembly process. --- ### 3. Application Use Cases This specific heat sink is categorized as a "High-Flow" solution, suitable for: 1. **Telecommunications:** Cooling high-speed processing chips in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but heat output is high. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units. --- ### 4. Thermal Performance Overview Thermal resistance is critical. As airflow (measured in Linear Feet per Minute - LFM) increases, the resistance decreases, allowing the component to stay cooler. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.14 | | 300 (1.5 m/s) | 2.62 | | 500 (2.5 m/s) | 1.73 |