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  • ATS-06F-39-C2-R0

  • AI
    The **ATS-06F-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | Straight (Square-cut) | | **Thermal Resistance** | ~18.94°C/W (Natural Convection) | --- ### 2. Physical Design Features The component belongs to the **pushPIN™** series, which incorporates several distinct engineering features: * **Heat Sink Material:** Made of aluminum for a balance of lightweight construction and high thermal conductivity. * **Surface Treatment:** The "Blue Anodized" finish is not just aesthetic; it increases emissivity and provides a protective layer against corrosion and electrical shorts. * **Fin Geometry:** It uses a high-density fin pattern to maximize surface area within a compact 45mm footprint. * **Pre-applied Interface:** Typically comes with a high-performance Phase Change Material (PCM) or Thermal Interface Material (TIM) on the base for immediate installation. --- ### 3. Attachment Mechanism The **"F"** and **"R0"** suffixes in the part number indicate specific mounting hardware: 1. **Push-Pins:** This model uses plastic push-pins that snap into pre-drilled holes in the Printed Circuit Board (PCB). 2. **Compression Springs:** A stainless steel spring is used with the pin to provide consistent pressure (clamping force) between the heat sink and the chip, ensuring optimal heat transfer. 3. **Hole Pattern:** Designed for specific industry-standard PCB hole spacing. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series/Mounting style. * **F:** Push-pin material/type (Plastic). * **39:** Specific fin/body geometry. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### 5. Application Usage This part is commonly found in: * **Telecommunications:** Cooling of networking ASICs. * **Embedded Systems:** Industrial PC processors. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameter requirements for the push-pin mounting?
    • ⤷ How does the thermal resistance change under forced airflow (CFM)?
    • ⤷ Can this heat sink be used with a different thermal interface material (TIM)?