ATS-06F-39-C2-R0
AI

The **ATS-06F-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
Below are the primary technical parameters for this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm |
| **Fin Style** | Straight (Square-cut) |
| **Thermal Resistance** | ~18.94°C/W (Natural Convection) |
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### 2. Physical Design Features
The component belongs to the **pushPIN™** series, which incorporates several distinct engineering features:
* **Heat Sink Material:** Made of aluminum for a balance of lightweight construction and high thermal conductivity.
* **Surface Treatment:** The "Blue Anodized" finish is not just aesthetic; it increases emissivity and provides a protective layer against corrosion and electrical shorts.
* **Fin Geometry:** It uses a high-density fin pattern to maximize surface area within a compact 45mm footprint.
* **Pre-applied Interface:** Typically comes with a high-performance Phase Change Material (PCM) or Thermal Interface Material (TIM) on the base for immediate installation.
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### 3. Attachment Mechanism
The **"F"** and **"R0"** suffixes in the part number indicate specific mounting hardware:
1. **Push-Pins:** This model uses plastic push-pins that snap into pre-drilled holes in the Printed Circuit Board (PCB).
2. **Compression Springs:** A stainless steel spring is used with the pin to provide consistent pressure (clamping force) between the heat sink and the chip, ensuring optimal heat transfer.
3. **Hole Pattern:** Designed for specific industry-standard PCB hole spacing.
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### 4. Part Number Breakdown (Nomenclature)
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **06:** Series/Mounting style.
* **F:** Push-pin material/type (Plastic).
* **39:** Specific fin/body geometry.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
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### 5. Application Usage
This part is commonly found in:
* **Telecommunications:** Cooling of networking ASICs.
* **Embedded Systems:** Industrial PC processors.
* **Power Electronics:** Cooling MOSFET arrays or voltage regulators.
- ⤷
What are the specific PCB hole diameter requirements for the push-pin mounting?
- ⤷ How does the thermal resistance change under forced airflow (CFM)?
- ⤷ Can this heat sink be used with a different thermal interface material (TIM)?