The **ATS-06G-151-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "blue ice" series and is designed for efficient cooling of integrated circuits (ICs) and other electronic packages. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06G-151-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Resistance** | 3.99°C/W (at 1.0 m/s airflow) | | **Fin Type** | Fine Pitch (Rectangular) | --- ### Key Electronic & Mechanical Features #### 1. Heat Dissipation Mechanism This part is a **passive cooling component**. It increases the surface area of a semiconductor (like a CPU, FPGA, or Power MOSFET), allowing heat to transfer more efficiently into the surrounding air. The "Fine Pitch" fin design is optimized for environments with consistent airflow (forced convection). #### 2. pushPIN™ Attachment System Unlike simple adhesive tapes, this model uses a **pushPIN™** system: * **Secure Fit:** It uses a flexible spring-loaded mechanism that provides precise pressure for maximum thermal interface contact. * **Reliability:** It is resistant to shocks and vibrations, making it suitable for industrial or automotive electronics. * **Hardware:** Includes a pre-assembled spring and a plastic/brass pin for PCB mounting. #### 3. Thermal Interface Material (TIM) The part typically comes with a pre-applied **T766 thermal phase-change material** or similar high-performance grease. This fills the microscopic air gaps between the component and the heat sink, significantly lowering the thermal resistance. --- ### Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Computing:** Cooling of chipsets and high-speed processors on motherboards. * **Power Electronics:** Dissipating heat from voltage regulators and power modules. * **Industrial Controls:** Used in PLCs and motor drives where heat buildup can cause system failure.