The part number **ATS-07A-151-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 3.93°C/W (at 200 LFM) | | **Flow Direction** | XC (Cross-cut) / Omnidirectional | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS-07**: Series designation (pushPIN™ Heat Sink Tosca). * **A**: Specific attachment style or revision. * **151**: Internal dimensions/fin geometry code. * **C2**: Material and Finish code (**C2** typically indicates Aluminum with a Blue Anodized finish). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Cooling Features This heatsink is engineered for maximum efficiency in constrained spaces: 1. **pushPIN™ Attachment:** It uses a spring-loaded mechanism that ensures precise pressure over the component, improving thermal interface material (TIM) performance. 2. **Cross-Cut (XC) Fin Design:** The fins are cut in multiple directions. This allows the heatsink to be effective regardless of the direction of the airflow (omnidirectional), which is critical in crowded PCBS. 3. **Lightweight Construction:** Being made of Aluminum, it provides high thermal conductivity while minimizing the physical strain on the PCB or the chip package. 4. **Pre-applied TIM:** Many versions of this series come with pre-applied thermal interface material to simplify the assembly process. --- ### 4. Applications * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Managing heat in routers and switches. * **Power Electronics:** Cooling MOSFETs or power modules in power supplies. ---