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  • ATS-07D-98-C2-R0

  • AI
    The **ATS-07D-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by *Advanced Thermal Solutions (ATS)*, intended for cooling integrated circuits (ICs) and high-power electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 15.31°C/W (Unducted) | | **Dimensions** | 45mm x 45mm | | **Height (Fin)** | 20mm | | **Fin Style** | Cross-Cut (Pin Fin) | --- ### 2. Physical Design & Engineering The "C2" and "R0" designations in the suffix provide details about the material and finish: * **Fin Configuration:** It uses a **Cross-Cut** pattern. Unlike straight fins, cross-cut fins (often called pin fins) allow for omni-directional airflow, making them more efficient in systems where the exact direction of air current might fluctuate. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance phase-change material that ensures maximum heat transfer between the chip and the aluminum base. * **Mounting System:** It uses the **pushPIN™** system, which involves plastic or brass pins and a compression spring. This ensures a consistent pressure (Force) is applied to the component, preventing damage while maintaining thermal contact. --- ### 3. Application Use Cases This heatsink is generally found in high-reliability electronic environments: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Used on SoCs (System on Chips) that generate significant heat in compact enclosures. 3. **Power Electronics:** Managing heat for MOSFETs or high-density power modules. --- ### 4. Part Number Breakdown (Pattern) | Segment | Meaning | | :--- | :--- | | **ATS-07** | ATS Series Identifier | | **D** | Material / Design code | | **98** | Specific dimension/fin layout index | | **C2** | Thermal Interface Material (T766) / Performance level | | **R0** | RoHS Compliant / Revision code |
    ✨ Follow-up Questions
    • ⤷ What is the significance of the pushPIN mounting system compared to adhesive tape?
    • ⤷ How does 'unducted' thermal resistance differ from 'ducted' performance in this model?
    • ⤷ Is this heatsink compatible with BGA or LGA packages?