The part number **ATS-07F-153-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-pin (Fine Pitch) | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 11.95°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Details * **Dimensions:** The "153" in the part number corresponds to a footprint of **40mm x 40mm** with a height of **10mm**. This low profile makes it ideal for dense PCB layouts where vertical space is limited. * **Fin Style:** It features a **Straight-Fin** design. This allows for optimal airflow in a specific direction, typically used in systems with a dedicated chassis fan. * **Material and Finish:** It is made of extruded aluminum for lightweight thermal conductivity and finished with a **Blue Anodized** coating to prevent corrosion and improve emissivity. --- ### 3. Attachment Mechanism The **"C2-R0"** suffix indicates the specific hardware and thermal interface: * **Push-Pin Attachment:** The unit uses two plastic push-pins and springs. This ensures even pressure across the chip surface, improving heat transfer and making installation tool-less. * **T766 TIM:** It comes with a pre-applied Phase Change Material (T766). This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a consistent thermal bond. --- ### 4. Thermal Performance Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 11.95 | | **400 (2.0 m/s)** | 6.40 | | **600 (3.0 m/s)** | 5.20 | --- ### 5. Common Applications * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, and high-end processors. * **Networking Gear:** Used in routers and switches. * **Embedded Systems:** Industrial PCs where mechanical vibration resistance (provided by the springs) is necessary.