The **ATS-07F-17-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **blueICE™** series of high-performance heat sinks designed for thermal management in electronic circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific heat sink: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-07F-17-C2-R0 | | **Type** | Board Level Heat Sink (Push-Pin Mount) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Thermal Resistance** | 15.44° C/W (@ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Features The "C2" and "R0" designations in the part number refer to specific configurations regarding the material and the mounting hardware. ### Design and Airflow * **Straight Fin Design:** The fins are aligned to provide low pressure drop while maximizing surface area for heat dissipation. It is optimized for longitudinal airflow. * **Material:** Made from AL6063 aluminum, which offers a high thermal conductivity-to-weight ratio. ### Attachment System (push-PIN™) * **Secure Mounting:** It uses a push-pin mechanism with a flexible spring to provide consistent pressure on the heat source (CPU/GPU/FPGA), ensuring optimal contact. * **Ease of Install:** Designed for quick assembly onto pre-drilled holes in the Printed Circuit Board (PCB). ### Thermal Interface Material (TIM) * **T766:** The unit comes with a pre-applied phase-change thermal interface material. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a uniform layer. --- ## 3. Applications This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed processors and chipsets. 2. **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. 4. **Network Hardware:** Routers and switches requiring reliable 24/7 cooling. ---