The **ATS-07F-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.47°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | NO TIM (Standard) | --- ### 2. Design and Component Breakdown #### A. pushPIN™ Attachment System This specific model uses the ATS proprietary **pushPIN™** system. Instead of using messy adhesives or fragile clips, it utilizes: * **Compression Springs:** Provide precise pressure to ensure maximum surface contact between the heat sink and the component. * **Brass/Plastic Pins:** Secure the assembly into pre-drilled holes on the PCB. #### B. Heat Sink Geometry * **Square Profile:** The 25mm footprint is ideal for small form-factor electronics or localized hotspots on a motherboard. * **Height (30mm):** The relatively high profile (30mm) allows for a larger surface area, making it suitable for systems with vertical space but limited horizontal area. #### C. Material Properties * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized coating increases surface emissivity and provides corrosion resistance. --- ### 3. Application Use Cases This part is commonly found in industrial and consumer electronics where active cooling (fans) or strong passive airflow is present: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and high-speed motor drivers. --- ### 4. Thermal Performance Overview Thermal resistance indicates how efficiently the heat sink moves heat away from the source. For the **ATS-07F-75-C1-R0**: * **Low Airflow:** At 100 LFM (Linear Feet per Minute), resistance is higher (approx. 1.9°C/W). * **High Airflow:** At 500 LFM, resistance drops significantly (approx. 0.9°C/W), showing that this heat sink performs best in forced-convection environments.