The **ATS-07G-151-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Type** | Push Pin | | **Dimension (Length x Width)** | 35.00 mm x 35.00 mm | | **Height** | 20.00 mm | | **Pitch** | Fine Pitch (High density) | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~3.93°C/W (at 200 LFM) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System This component uses a specialized "push-pin" mechanism rather than traditional adhesive or clips. * **Ease of Installation:** Uses pre-assembled springs and pins to provide a secure, vibration-resistant mount. * **Compression Springs:** These ensure a specific amount of pressure (measured in grams) is applied to the chip to maximize heat transfer without cracking the die. ### B. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with a **pre-applied phase change material** or thermal tape. This eliminates the need for manual application of thermal paste during assembly. ### C. Fin Design The **ATS-07G** series uses a "fine pitch" design. * **High Surface Area:** The fins are packed closely together to provide maximum surface area for cooling. * **Airflow Requirement:** Due to the density of the fins, this heat sink is designed for **forced air cooling** (using a fan) rather than natural convection. --- ## 3. Common Applications This heat sink is designed for medium-power electronic components that generate significant heat in a small footprint: 1. **Processors/SoCs:** Cooling BGAs and ARM processors in embedded systems. 2. **Network Hardware:** Used on switches, routers, and telecommunication hardware. 3. **Power Supplies:** Cooling high-efficiency MOSFETs or voltage regulators. 4. **Graphics:** Auxiliary cooling for smaller GPU chipsets or memory controllers. ---