The part number **ATS-07H-75-C3-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 15.02°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by Advanced Thermal Solutions: | Segment | Meaning | Details | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **07H** | Series/Mounting | Indicates the Push-Pin attachment style | | **75** | Dimensions | Specific footprint and profile code (25x25mm) | | **C3** | Thermal Interface | Pre-applied T766 Phase Change Material | | **R0** | RoHS Status | Compliant with environmental regulations | --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it is critical for the electronic health of a system: * **Thermal Dissipation:** It increases the surface area of a hot component, allowing heat to transfer into the ambient air more efficiently. * **Thermal Interface Material (TIM):** The "C3" designation means it comes with a high-performance phase-change material on the base, which fills microscopic air gaps between the chip and the heat sink. * **Mechanical Stability:** The push-pin and spring mechanism ensure constant, even pressure on the semiconductor package, preventing air pockets and ensuring reliable cooling even under vibration. --- ### 4. Thermal Performance Table Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the enclosure: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.02 | | 300 | 1.5 | 6.30 | | 500 | 2.5 | 4.60 | | 700 | 3.5 | 3.90 |