The **ATS-08F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 10.00mm | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | XCUT | --- ### Component Breakdown #### 1. The Fin Design (XCUT) The "XCUT" geometry refers to the way the aluminum fins are arranged. This pattern is designed to provide a high surface area while allowing for multi-directional airflow. This is crucial in dense electronic enclosures where air might not flow in a single linear path. #### 2. Thermal Interface Material (TIM) The **C2** in the part number indicates that the heat sink comes pre-applied with **T766** thermal phase change material. This ensures optimal heat transfer between the electronic component (heat source) and the aluminum base of the heat sink. #### 3. Attachment System (pushPIN™) Instead of using messy adhesives or permanent thermal epoxy, this part uses a mechanical push-pin system with a brass or plastic pin and a high-tension spring. * **Benefits:** Provides consistent pressure for better thermal contact and allows for easy removal/rework. #### 4. Material and Coating * **Aluminum:** Lightweight with excellent thermal conductivity. * **Blue Anodized:** The coating isn't just aesthetic; it protects the aluminum from corrosion and slightly improves "emissivity," which helps in heat radiation. --- ### Typical Applications * **Embedded Systems:** Cooling processors on motherboards. * **Telecommunications:** Cooling ASICs in networking switches. * **Power Supplies:** Dissipating heat from voltage regulators.