ATS-08F-27-C2-R0
AI

The **ATS-08F-27-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
Below are the key mechanical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Fin Type** | XCUT (Cross-cut) |
| **Dimensions** | 70.00mm x 70.00mm |
| **Height** | 12.70mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 12.24 °C/W (Unducted Flow @ 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Design Characteristics
This component is engineered for specific airflow conditions and mounting reliability:
* **XCUT Fin Pattern:** The cross-cut fin geometry allows for omnidirectional airflow. This means the heat sink performs efficiently regardless of which direction the cooling air is coming from.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. This provides consistent pressure (7-10 lbs) on the electronic component, ensuring maximum heat transfer and mechanical stability.
* **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip.
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### 3. Application Use Cases
The ATS-08F-27-C2-R0 is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of networking ASICs and high-speed processors.
2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (only 12.7mm high).
3. **Power Electronics:** Dissipating heat from MOSFETs or power modules.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on airflow speed (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 12.24 |
| 300 | 1.5 | 2.49 |
| 500 | 2.5 | 1.43 |
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- ⤷
What is the difference between XCUT and Straight Fin heat sinks?
- ⤷ How do I calculate the required airflow for this heat sink?
- ⤷ Can the pushPIN mounting be adjusted for different PCB thicknesses?