The **ATS-08F-60-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications The part number encodes specific data regarding its dimensions, thermal performance, and attachment method. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 56.89mm x 56.89mm x 25.00mm | | **Thermal Resistance** | 1.50°C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin (Plastic) | | **Interface Material** | T766 (High-performance Thermal Phase Change) | --- ### 2. Design and Engineering Features #### A. Fin Geometry The "maxiFLOW" design features a **flared fin structure**. Unlike traditional straight fins, these fins angle outward, which: * Reduces pressure drop. * Increases the surface area for heat dissipation. * Optimizes airflow in high-density electronic enclosures. #### B. Attachment Mechanism (Push-Pin) The **-R0** suffix indicates the specific attachment kit. This model uses a plastic push-pin system with a compression spring. * **Purpose:** Ensures consistent pressure between the heat sink and the component, maximizing thermal transfer. * **Hole Pattern:** Requires pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a phase-change material that softens at operating temperatures to fill microscopic air gaps between the chip and the heat sink base, significantly lowering thermal resistance. --- ### 3. Applications This specific heat sink is typically used for cooling: * **ASICs and FPGAs:** Used in networking and telecommunications equipment. * **Processors:** High-speed embedded computing modules. * **Power Electronics:** Components that generate significant localized heat. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving through the fins: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.50 | | 300 | 1.15 | | 400 | 0.95 | | 500 | 0.82 |