The **ATS-08H-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine Pitch (straight fin) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 30mm | | **Thermal Resistance** | ~6.67°C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System This specific model uses the **pushPIN™** system, which consists of a flexible, spring-loaded mechanism. * **Consistency:** It provides a precise amount of pressure (load) on the electronic component to ensure optimal thermal interface contact. * **Hardware:** It typically includes brass or plastic pins with a stainless steel spring. #### B. High-Performance Fin Design The "Fine Pitch" geometry is engineered for maximum surface area. * **Airflow:** Designed for forced-air cooling environments (systems with fans). * **Heat Transfer:** The vertical fins allow air to pass through efficiently while pulling heat away from the baseplate. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal grease or pad pre-applied to the base: * **T766 Phase Change Material:** This is a high-performance thermal compound that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Physical Dimensions (Metric) | Dimension | Measurement | | :--- | :--- | | **Width** | 45.00 mm | | **Length** | 45.00 mm | | **Height** | 30.00 mm | | **Hole Spacing** | ~38.00 mm | --- ### 4. Application Use Cases 1. **Telecommunications:** Cooling High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where high-profile cooling is required. 3. **Power Electronics:** Transistor modules and power converters that generate significant localized heat. ---