The **ATS-10F-147-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, intended for cooling integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics. Here are the core specifications: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance (Unducted)** | 13.52 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.86 °C/W @ 100 LFM | | **Fin Configuration** | Fine Pitch (Straight Fin) | --- ### 2. Key Design Elements #### A. Fin Profile (Fine Pitch) The "147" series features a high-density straight fin design. This increases the total surface area available for heat dissipation. This is particularly effective in environments with forced airflow (fans), as seen by the significant drop in thermal resistance when ducted. #### B. Attachment System (pushPIN™) Instead of using messy thermal adhesives or fragile clips, this part uses a **spring-loaded push-pin** mechanism. * **Benefits:** Ensures constant, uniform pressure on the chip, which optimizes the thermal interface material (TIM) performance. * **Hardware:** It typically comes with a pre-assembled brass or plastic pin and a high-performance compression spring. #### C. Material and Coating * **Aluminum 6063:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Beyond aesthetics, the anodization layer provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. --- ### 3. Application Use Cases This specific heatsink is generally found in: * **Network Switches/Routers:** For cooling ASICs and Processors. * **Embedded Systems:** For industrial PCs where vertical space is limited (10mm height). * **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **10F:** 10mm Height / Fine Pitch Series * **147:** Specific internal design/dimension code * **C2:** Thermal Interface Material (usually features T766 phase change material or similar) * **R0:** Revision/RoHS compliance status