The **ATS-18A-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs through convection. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight (maxiFLOW™ design) | | **Attachment Method** | pushPIN™ (Brass pins / Plastic pins) | | **Thermal Resistance** | 5.37°C/W (at 200 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 10mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature to identify its features: * **ATS-18A**: Refers to the series and specific internal revision code. * **75**: Denotes the specific thermal performance and size profile within that series. * **C3**: Indicates the **Thermal Interface Material (TIM)**. In this case, it usually refers to **Phase Change Material (PCM)** or high-performance thermal grease pre-applied to the base. * **R0**: Refers to the packaging and revision status (RoHS compliant). --- ### 3. Key Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases surface area and improves airflow intake, which is critical for high-density PCB layouts. * **pushPIN™ Attachment:** This model uses a tool-free push-pin system with a compression spring. This ensures even pressure across the component for optimal heat transfer and prevents damage during mechanical vibration. * **Pre-Applied TIM:** It comes with a pre-applied thermal pad/grease, reducing assembly time and ensuring a consistent thermal bond between the heat sink and the chip. --- ### 4. Application Use Cases This part is typically used in space-constrained environments where high-power components generate significant heat: 1. **Telecommunications:** Network routers and high-speed switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power modules.