The **ATS-18B-161-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 1.15 °C/W @ 700 LFM | | **Thermal Resistance (Static)** | 4.74 °C/W @ Unducted Flow | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | --- ### 2. Key Design Elements #### A. Fin Profile (Straight Fin) The "161" in the part number corresponds to a specific fin geometry. Straight fin designs are optimized for **ducted airflow** environments. They offer low pressure drop and allow air to move smoothly across the surface area to carry heat away from the semiconductor junction. #### B. Attachment Mechanism (Push-Pin) Instead of using thermal adhesive (which can fail over time) or screws (which require backplates), this part uses a **brass push-pin with a steel spring**. * **Precision:** The spring provides a consistent "Pre-Assembled" compression force. * **Reliability:** It ensures optimal contact between the heat sink base and the electronic component, minimizing the thermal interface resistance. #### C. Thermal Interface Material (TIM) The **"C2"** designation in the part number typically refers to the type of thermal interface material pre-applied to the base. In this series: * **T766:** A high-performance thermal phase-change material or grease is usually applied to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Electronic Application Usage This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling high-speed network processors. 2. **Industrial PCs:** Ensuring stability in fan-less or high-airflow enclosures. 3. **Embedded Systems:** Managing heat in compact PCB layouts where vertical space (20mm) is limited. --- ### 4. Part Number Breakdown ```text ATS - 18 B - 161 - C2 - R0 | | | | | | | | | | | └─ Revision Code | | | | └────── Thermal Interface Material (T766) | | | └──────────── Fin Pitch/Design Code | | └───────────────── Dimension/Shape Code | └─────────────────── Attachment Type (Push-Pin) └───────────────────────── Manufacturer (Advanced Thermal Solutions) ```