## Technical Overview: ATS-18B-22-C2-R0 The **ATS-18B-22-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, which is engineered to provide low thermal resistance and maximized surface area for cooling electronic components. --- ### 1. Component Specifications Below are the primary mechanical and thermal specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 58.42mm x 39.60mm x 22.86mm | | **Thermal Resistance** | 1.90°C/W @ 200 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management (Convection Cooling) The core purpose of this part is to dissipate heat from surface-mount components like CPUs, FPGAs, or GPUs. The "maxiFLOW" design uses a **flared fin structure**, which increases the surface area for air contact while maintaining a low pressure drop. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the ATS-18B-22-C2-R0 uses a mechanical **pushPIN™** system: * **Spring Mechanism:** Provides a consistent, precise pressure (load) on the electronic component, ensuring optimal contact with the Thermal Interface Material. * **Reliability:** Mechanical fastening is more vibration-resistant than thermal tape, making it suitable for industrial or telecommunications hardware. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the component die and the heat sink base. * **Efficiency:** T766 is a high-performance phase-change or grease-like material designed for high thermal conductivity. --- ### 3. Application Use Cases * **Networking Equipment:** Switches and routers where high-velocity airflow is present. * **Embedded Systems:** Industrial PCs requiring ruggedized cooling solutions. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. --- ### 4. Part Number Breakdown (Nomenclature) ```text ATS - 18 - B - 22 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Color/Finish (C2 = Blue/Black Anodized) | | | +------------ Height (in mm) | | +----------------- Fin Pitch/Style | +---------------------- Base Series ID +---------------------------- Advanced Thermal Solutions ```