ATS-18B-76-C2-R0
AI

The **ATS-18B-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
---
## 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Base Dimensions** | 45mm x 40mm |
| **Height** | 15mm |
| **Thermal Resistance** | 2.73°C/W @ 200 LFM |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
---
## 2. Component Breakdown
### A. The maxiFLOW™ Design
The "maxiFLOW" geometry features a flared fin structure. Unlike standard straight-fin heat sinks, this design increases the surface area and encourages more airflow through the fin field, significantly reducing the thermal resistance between the component junction and the ambient air.
### B. pushPIN™ Attachment
The "R0" suffix indicates the use of the **pushPIN™** mounting system.
- **Mechanism:** It uses a brass or plastic pin with a stainless steel spring.
- **Benefit:** This ensures constant, high pressure on the component (IC), which optimizes the performance of the Thermal Interface Material (TIM).
- **Hole Pattern:** It requires specific drill holes on the PCB for secure mounting.
### C. Thermal Interface Material (T766)
This part comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the chip, ensuring maximum heat transfer efficiency.
---
## 3. Applications
This heat sink is typically found in:
* **Telecommunications:** Optical modules and networking switches.
* **Computing:** Embedded systems and localized cooling for power regulators.
* **Industrial:** High-speed data acquisition boards where space is restricted (due to the low 15mm profile).
---
- ⤷How do I calculate the correct LFM (Linear Feet per Minute) for this heat sink?
- ⤷ What is the specific PCB hole pattern required for the pushPIN attachment?
- ⤷ Are there alternative finishes available for higher corrosion resistance?