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  • ATS-18D-64-C2-R0

  • AI
    The **ATS-18D-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.48 °C/W (@ 200 LFM) | | **Thermal Resistance (Static)** | 9.39 °C/W | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 25.00 mm | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Grease) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18**: Indicates the series or specific design family. * **D**: Material/Style indicator. * **64**: Specific footprint size and geometry code. * **C2**: Material and Thermal Interface Material (TIM) code. In this case, it usually signifies Aluminum with T766 thermal grease. * **R0**: Revision or finish code (Blue Anodized). --- ### 3. Key Components & Features #### A. The pushPIN™ Attachment System The "pushPIN" mechanism is a crucial part of this component. It replaces traditional adhesive tapes or clumsy clips. - **Components:** It consists of a plastic or brass pin and a compression spring. - **Benefit:** Ensures constant, uniform pressure across the thermal interface, which optimizes heat transfer from the chip to the heat sink. #### B. Straight Fin Design The "Straight Fin" geometry is optimized for **forced-air cooling** (airflow from a fan). The vertical fins provide a large surface area for heat dissipation while maintaining a low pressure drop. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for the engineer to manually apply thermal paste, ensuring a clean and efficient thermal bond right out of the box. #### D. Blue Anodized Finish The blue anodizing isn't just for aesthetics; it provides: - Increased surface emissivity (improving radiation cooling). - Corrosion resistance. - Electrical insulation on the surface of the aluminum. --- ### 4. Ideal Applications - **Embedded Systems:** Cooling microprocessors on PCBs. - **Telecommunications:** Used in routers and switches. - **Power Electronics:** Managing heat for MOSFETs and power modules.
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive-based heat sink mounting?
    • ⤷ How does the LFM (Linear Feet per Minute) airflow rating affect this heat sink's performance?
    • ⤷ Are there copper versions of this heat sink for higher thermal conductivity?