ATS-18D-64-C2-R0
AI

The **ATS-18D-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Fin Style** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Flowing)** | 1.48 °C/W (@ 200 LFM) |
| **Thermal Resistance (Static)** | 9.39 °C/W |
| **Dimensions (L x W)** | 40.00 mm x 40.00 mm |
| **Height** | 25.00 mm |
| **Finish** | Blue Anodized |
| **Interface Material** | T766 (Thermal Grease) |
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### 2. Breakdown of the Model Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **18**: Indicates the series or specific design family.
* **D**: Material/Style indicator.
* **64**: Specific footprint size and geometry code.
* **C2**: Material and Thermal Interface Material (TIM) code. In this case, it usually signifies Aluminum with T766 thermal grease.
* **R0**: Revision or finish code (Blue Anodized).
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### 3. Key Components & Features
#### A. The pushPIN™ Attachment System
The "pushPIN" mechanism is a crucial part of this component. It replaces traditional adhesive tapes or clumsy clips.
- **Components:** It consists of a plastic or brass pin and a compression spring.
- **Benefit:** Ensures constant, uniform pressure across the thermal interface, which optimizes heat transfer from the chip to the heat sink.
#### B. Straight Fin Design
The "Straight Fin" geometry is optimized for **forced-air cooling** (airflow from a fan). The vertical fins provide a large surface area for heat dissipation while maintaining a low pressure drop.
#### C. Thermal Interface Material (TIM)
The base comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for the engineer to manually apply thermal paste, ensuring a clean and efficient thermal bond right out of the box.
#### D. Blue Anodized Finish
The blue anodizing isn't just for aesthetics; it provides:
- Increased surface emissivity (improving radiation cooling).
- Corrosion resistance.
- Electrical insulation on the surface of the aluminum.
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### 4. Ideal Applications
- **Embedded Systems:** Cooling microprocessors on PCBs.
- **Telecommunications:** Used in routers and switches.
- **Power Electronics:** Managing heat for MOSFETs and power modules.
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What is the difference between pushPIN and adhesive-based heat sink mounting?
- ⤷ How does the LFM (Linear Feet per Minute) airflow rating affect this heat sink's performance?
- ⤷ Are there copper versions of this heat sink for higher thermal conductivity?