ATS-18D-83-C2-R0
AI

The **ATS-18D-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, and ASICs.
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL-6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Heat Sink Type** | Pin Fin (Straight) |
| **Thermal Resistance** | 1.62°C/W (at 200 LFM) |
| **Footprint (L x W)** | 30.00mm x 30.00mm |
| **Height (H)** | 30.00mm |
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### 2. Design Features
* **pushPIN™ Attachment:** This model utilizes the ATS pushPIN™ system, which ensures a precise and secure fit to the PCB. It consists of a brass or plastic pin with a stainless steel spring to provide consistent pressure on the component.
* **Blue Anodized Finish:** The anodized coating not only improves the aesthetic but also provides corrosion resistance and slightly enhances radiant heat transfer.
* **Pin Fin Geometry:** The vertical pins allow for omnidirectional airflow, meaning the heat sink performs well regardless of which direction the cooling air is flowing across the board.
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### 3. Thermal Performance Metrics
Thermal resistance is critical for determining how well the part prevents overheating.
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 1.62 |
| **300 (1.5 m/s)** | 1.25 |
| **400 (2.0 m/s)** | 1.06 |
| **500 (2.5 m/s)** | 0.95 |
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### 4. Part Number Breakdown
The part number follows the standard ATS nomenclature:
1. **ATS**: Advanced Thermal Solutions.
2. **18**: Design series.
3. **D**: Indicates the attachment method (pushPIN™).
4. **83**: Specific dimension code (30x30mm).
5. **C2**: Material/Finish code (Blue Anodized).
6. **R0**: Revision/Packaging code.
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What are the PCB hole requirements for the pushPIN attachment?
- ⤷ Can this heat sink be used with thermal tape instead of pins?
- ⤷ Is there a low-profile version of this model for tight enclosures?