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  • ATS-18D-83-C2-R0

  • AI
    The **ATS-18D-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL-6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Pin Fin (Straight) | | **Thermal Resistance** | 1.62°C/W (at 200 LFM) | | **Footprint (L x W)** | 30.00mm x 30.00mm | | **Height (H)** | 30.00mm | --- ### 2. Design Features * **pushPIN™ Attachment:** This model utilizes the ATS pushPIN™ system, which ensures a precise and secure fit to the PCB. It consists of a brass or plastic pin with a stainless steel spring to provide consistent pressure on the component. * **Blue Anodized Finish:** The anodized coating not only improves the aesthetic but also provides corrosion resistance and slightly enhances radiant heat transfer. * **Pin Fin Geometry:** The vertical pins allow for omnidirectional airflow, meaning the heat sink performs well regardless of which direction the cooling air is flowing across the board. --- ### 3. Thermal Performance Metrics Thermal resistance is critical for determining how well the part prevents overheating. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.62 | | **300 (1.5 m/s)** | 1.25 | | **400 (2.0 m/s)** | 1.06 | | **500 (2.5 m/s)** | 0.95 | --- ### 4. Part Number Breakdown The part number follows the standard ATS nomenclature: 1. **ATS**: Advanced Thermal Solutions. 2. **18**: Design series. 3. **D**: Indicates the attachment method (pushPIN™). 4. **83**: Specific dimension code (30x30mm). 5. **C2**: Material/Finish code (Blue Anodized). 6. **R0**: Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ Can this heat sink be used with thermal tape instead of pins?
    • ⤷ Is there a low-profile version of this model for tight enclosures?