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  • ATS-18F-47-C2-R0

  • AI
    The **ATS-18F-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.30°C/W (at 100 LFM / 0.5 m/s) | | **Flow Pattern** | Cross-cut (Multiple directional airflow) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the part fits within PCB clearance constraints. | Dimension | Measurement (mm) | | :--- | :--- | | **Length (A)** | 30.00 mm | | **Width (B)** | 30.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 35.00 mm | | **Pitch (F)** | 35.00 mm | --- ### 3. Key Electronic Components & Features #### A. Push-Pin Mounting System This model uses the **pushPIN™** system, which allows for secure attachment to the PCB. It features: * Pre-drilled holes in the heat sink. * Compressed springs that provide consistent pressure for maximum thermal interface contact. * Ease of assembly compared to adhesive-based solutions. #### B. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the electronic component and the heat sink base, significantly reducing thermal resistance. #### C. Cross-Cut Fin Design Unlike straight-fin heat sinks, the cross-cut design allows airflow to enter from multiple directions. This makes it ideal for electronics where the direction of the cooling fan's exhaust might be unpredictable or obstructed. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** MOSFET and Voltage Regulator (VRM) cooling. * **Networking:** Routers, switches, and small-form-factor telecommunications hardware. ---
    ✨ Follow-up Questions
    • ⤷ What are the different push-pin material options for this series?
    • ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
    • ⤷ 400 LFM)?
    • ⤷ Is this heat sink compatible with standard 25mm PCB hole patterns?