ATS-18F-47-C2-R0
AI

The **ATS-18F-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 9.30°C/W (at 100 LFM / 0.5 m/s) |
| **Flow Pattern** | Cross-cut (Multiple directional airflow) |
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### 2. Physical Dimensions
Precision sizing is critical for ensuring the part fits within PCB clearance constraints.
| Dimension | Measurement (mm) |
| :--- | :--- |
| **Length (A)** | 30.00 mm |
| **Width (B)** | 30.00 mm |
| **Height (C)** | 25.00 mm |
| **Pitch (E)** | 35.00 mm |
| **Pitch (F)** | 35.00 mm |
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### 3. Key Electronic Components & Features
#### A. Push-Pin Mounting System
This model uses the **pushPIN™** system, which allows for secure attachment to the PCB. It features:
* Pre-drilled holes in the heat sink.
* Compressed springs that provide consistent pressure for maximum thermal interface contact.
* Ease of assembly compared to adhesive-based solutions.
#### B. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with a pre-applied high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the electronic component and the heat sink base, significantly reducing thermal resistance.
#### C. Cross-Cut Fin Design
Unlike straight-fin heat sinks, the cross-cut design allows airflow to enter from multiple directions. This makes it ideal for electronics where the direction of the cooling fan's exhaust might be unpredictable or obstructed.
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### 4. Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** MOSFET and Voltage Regulator (VRM) cooling.
* **Networking:** Routers, switches, and small-form-factor telecommunications hardware.
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- ⤷
What are the different push-pin material options for this series?
- ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
- ⤷ 400 LFM)?
- ⤷ Is this heat sink compatible with standard 25mm PCB hole patterns?