The **ATS-21D-101-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications This part belongs to the **maxiFLOW™** series, which features a low-profile, high-performance fin geometry. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-21D-101-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The "electronic" nature of this part refers to its physical integration into a PCB assembly. * **Fin Design (maxiFLOW™):** The spread-fin design increases surface area and creates turbulence, which maximizes heat dissipation into the surrounding air. This is critical for preventing "thermal throttling" in semiconductors. * **PushPIN™ Attachment:** The "R0" suffix indicates the mounting hardware. It uses a push-pin mechanism with a specific spring tension to ensure consistent pressure (thermal contact) between the heat sink and the electronic chip. * **Thermal Interface Material (TIM):** It comes with pre-applied **T766** phase-change material. This fills microscopic air gaps between the component and the heat sink to ensure efficient heat transfer. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the specific electronic requirements: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **21D** | Series/Product Family | | **101** | Specific size and fin configuration | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision/Hardware Kit (Standard Push-Pin) | --- ### 4. Application in Circuits This part is typically used in the following electronic environments: * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Embedded Systems:** For SOCs (System on Chips) that run at high clock speeds. * **Telecommunications:** Cooling ASICs in networking switches or routers.