The **ATS-21F-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" series designed for cooling semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 30mm | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | --- ### 2. Key Components & Materials #### A. The Heat Sink Body * **Aluminum Construction:** Aluminum is used for its high thermal conductivity and lightweight properties. * **Straight Fin Design:** The fins are aligned to provide a clear path for airflow, making it ideal for systems with directional fans (forced air cooling). * **Blue Anodizing:** This chemical treatment increases corrosion resistance, provides electrical insulation on the surface, and slightly improves emissivity for radiant heat transfer. #### B. The Attachment System (Push-Pins) * **Plastic Push-Pins:** These provide a secure, vibration-resistant attachment to the PCB. * **Compression Springs:** The springs apply a precise amount of downward pressure (load) on the electronic chip, ensuring maximum contact with the thermal interface material without damaging the silicon. --- ### 3. Thermal Interface Material (TIM) The part number suffix **-C2** typically indicates the type of pre-applied thermal material or the specific kit configuration: * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component to lower thermal resistance. * **Standard Type:** Often features **T766** or similar high-performance phase-change material or thermal grease. --- ### 4. Typical Applications This part is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial PC:** Cooling of embedded processors in rugged environments. 3. **Power Electronics:** Managing heat in power converters and motor drives. --- ### 5. Drawing Reference (Mechanical) ```text 40mm [L] <----------> +----------+ ^ | |||||||| | | | |||||||| | | 40mm [W] | |||||||| | | +----------+ v || [Push-Pins] ```